One of the biggest complaints in PCB assembly is poor quality footprints. Learn tips to create a high-quality PCB library and DFA. • Component package terminal lead forms and their respective solder joint goal calculations per IPC-7352. What is a terminal Knee, Heel and Toe? • The Fabrication and Assembly tolerances were removed, and all negative solder joint goals changed to 0.00. How does this impact the resulting pad stack? Why was this update necessary? • The Pad Stack naming convention was upgraded. • Learn about fabrication Classes 1, 2 & 3 and the relationship between footprint Density Levels L, N & M. • Collapsing and Non-collapsing BGA footprints. Why and what are non-collapsing BGA balls and their recommended pad stack? What is solder mask defined? • Silkscreen and Assembly Polarity Markings for Pin 1 location and when are these necessary. What size and shape should be the silkscreen polarity marker. • Courtyard Excess sizes and what are they used for. • IPC-7093A BTC and solder mask defined thermal pads for SON & QFN and the GND via placement and how many vias? Paste mask reduction percentage. • Standard component packages vs: Non-standard packages. • Why do Through-hole components require stand-offs or kinked leads? • 3D STEP models used to quality control footprints • Solder Mask over size, 1:1 scale and solder mask defined pads for Flex Circuits. • EIA Chip Package Names and Sizes – 0201, 0402, 0603, 0805, 1206, 1812 • Japanese 20% rule for semiconductor packages. • Standard JEDEC dimensional letters and why these are important. • iNEMI rules for electronic device part numbers, case codes, package dimensions • Zero Component Orientations and why the footprint length is horizontal? • Through-hole pad stack calculations for hole, annular ring, anti-pad, thermal relief • SMD pad shapes – oblong, rectangle, rounded rectangle, D-Shape, square, rounded square This will be a fast-paced presentation and the Power Point file will be given out to all attendees. Bring your USB thumb drive or provide an email address. All questions will be answered during the presentation.
SpeakerCredentials
Tom Hausherr is founded of PCB Libraries. He has 50 years' experience in PCB design and library management, and 30 years' working with standards groups on land pattern development.
