ELECTRONIC PACKAGING: THE NEXT 20 YEARS

Program Description:

The future of electronic packaging is bright for package engineer as many new applications depend on advanced packaging solutions rather than Moore’s Law for improved performance and cost. Current mechanical, thermal, material, and electrical issues will multiply as solutions are required for heterogeneous integration, high reliability, low power, low loss, good thermal and electrical performance, and optimized cost and footprint. Advances in Fan-Out Wafer and Panel Level Packaging are adding value to the mobile, automotive, and IoT industries, but new package architectures and designs are needed to address 5G, Autonomous Driving, Artificial Intelligence, and Virtual/Augmented Reality. There are many packaging challenges ahead and significant advancements will be required in package innovation over the next 20 years.

INTEL CORPORATION

Registration Requested:

Beth Keser Ph.d.
bill@imaps.org

Speakers Credentials:
Director of Packaging Engineering

Speakers Linked-In Page:
Del Mar Electronics & Manufacturing Show Sponsors