2020 Seminar Schedule

Discuss proper design standards when developing membrane interfaces utilizing printed electronics. Limitations on printed components Vs. Solid State components.

In today’s complex and high-risk sourcing environment, strategic partnerships with component and inventory management experts are crucial. Suntsu will explain the different types of inventory management programs available to customers and how to leverage them to reduce raw cost, improve cash flow, and lower operating expense.

When designing short field LED lighting it's important to understand the color temperature and identify the right diode for the application. This seminar will dive into the basic understanding of proper Bin matching and heat displacement materials used in LED applications.

This presentation focuses on solder paste flux, liquid flux and wire solder fluxes and how their usage and the ingredients can affect PCBAs. If no clean fluxes are partially cleaned then the flux ingredients can pose a risk similar to un-washed high activity water soluble fluxes. Rework of solder joints increases the intermetallic layer thickness which can lead to mechanical fractures. Voiding in solder joints can lead to failures due to over-heating and mechanical fractures. Recommendations to mitigate risk will be given in the form of best practices for use of solder pastes and fluxes.

Thermal design options for high speed processors or high power LED components. What are the best methods to reduce temperature in a low air flow or sealed enclosure environment.

We're covering the basics of how to successfully use spring-loaded and pneumatic test probes inside a mechanical, pneumatic or vacuum test fixture to perform a functional test. Test probes may look a simple pin or needle to some but are one of the most underestimated components in functional testing. If chosen properly, even tough-to-access test points such as those with OSP coating can be hit reliably. If the wrong parts however are chosen, several retests maybe necessary which can be costly. We would like to show how to avoid that. The presentation is made for every skill level and you do not have to be a production-line engineer to attend but just need to have a general interest in that topic. Asides from proper design for testability, we also show a variety of both legacy and novelty probe and fixture designs - all in form of an interesting hands-on demo.

This presentation gives you an overview of different kind of wireless power transfer applications in all branches. To choose the correct coil combination for an application, the technical background will be described. The coupling, the efficiency, the wire type and the ferrite material are influencing the wireless power transfer system and are the key for the needed coil pair. With some tips and tricks about the EMI behavior of wireless power transfer system. At the end, useful tools from Würth Elektronik will help you to choose the correct coil pairs.

In today’s complex and high-risk sourcing environment, strategic partnerships with component and inventory management experts are crucial. Suntsu will explain the different types of inventory management programs available to customers and how to leverage them to reduce raw cost, improve cash flow, and lower operating expense.

Robert will cover the latest technology for timing and synchronization of processor / networks.

This Seminar will discuss in depth the benefits of mechanical relay technology and how it applies to different industries, Automotive and commercial applications. As well overview of board level switches and applications.

Newly available high power SiC MOSFET modules achieve efficiency and performance levels that are unobtainable with even the best state of the art silicon IGBTs. While the cost of these modules is still prohibitive for many applications, reductions in system cost and energy savings are driving increasing demand. This presentation will show the latest SiC module offering and the explore the exciting benefits provided by this technology.